1. Exceptional High-Temperature Resistance:
The polished tungsten target material possesses an extremely high melting point, reaching up to 3422°C. This remarkable thermal stability allows it to maintain performance in elevated temperature environments, making it ideal for applications that involve high energy and temperature. Additionally, the low coefficient of thermal expansion implies minimal distortion even under thermal stress.
2. Superior Mechanical and Chemical Properties:
High-density and exceptional hardness characterize polished tungsten materials, which ensures significant wear resistance. Furthermore, they exhibit outstanding resistance to acids, bases, and other reactive gases, ensuring longevity and reliability in stringent operational conditions.
3. Good Electrical and Thermal Conductivity:
Polished tungsten targets exhibit proficient electrical and thermal conductivity, which benefit the sputtering process by effectively dissipating heat generated during operations. This feature prevents excessive temperature buildup that could otherwise compromise the integrity of both the target and the deposited films.
4. Surface Quality and Stability:
The precision polishing process enhances the surface quality of the tungsten, achieving a high degree of smoothness essential for deposition applications. A high-quality surface minimizes arcing and particle ejection during the sputtering process, which contributes significantly to the uniformity and consistency of the films being produced.
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